Quality & Lead-free (Pb-free): Packaging Information

New technologies are raising the stakes on chip performance in environments ranging from deep space to the human body. These complicated systems require an equally reliable and cost efficient package that is designed for the mission. TI integrates packaging technology with design, materials, assembly processes, cost efficiencies, quality and volume to enable our customers to derive the most value from their innovations.

Package Selection Guides  By Package Type  By Industry Standard Terms  By JEDEC Code  By Package Pitch  By Package Max Height  By TI Package Designator

Additional Resources  Find Devices by Package Designator  Related Documents for Packaging  Packaging Terminology  Top Side Marking Formats  Introduction to LLP® (Leadless Leadframe Package)  Advanced Packaging Technology - Assembly

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 Lead-Free Process Solutions

Moisture Sensitivity

In the transition from Leaded to Lead (Pb)-Free products, a common question of interest to semiconductor users is the Moisture Sensitivity Level of the part. The Moisture Sensitivity Level (MSL) is a JEDEC industry standard classification that defines the length of time products can be safely exposed to the ambient environment prior to high-temperature reflow soldering.