Selection Guide By Package Type


Plastic: ARRAY LLP    COG    FBGA    ISOLATED TO220    LAMINATE CSP    LAMINATE TCSP    LAMINATE UCSP    LBGA    LLP    LLP COL    LQFP    LQFP EXP PAD    LTCC    MDIP    MICRO SMD    MICRO SMDXT    MICRO-ARRAY    MINI SOIC    MINI SOIC EXP PAD    PLCC    POS    PQFP    PSOP    SC-70    SOIC NARROW    SOIC WIDE    SOT-223    SOT-23    SSOP    SSOP-EIAJ    TEPBGA    TFBGA    TO-220    TO-247 SINGLE GAUGE    TO-252    TO-263    TO-263 THIN    TO-92    TQFP    TQFP EXP PAD    TSOT    TSSOP    TSSOP EXP PAD    UFBGA   

Hermetic: CCGA    CERDIP    CERPACK    CQFP    CQGP    LCC    SIDEBRAZE    TO-100    TO-3    TO-39    TO-46    TO-5    TO-99    TO-PMOD   

Other: DIE    WAFER

10-pins   
10-pins 
Product Folder
(Datasheet)
Description Product Type Package Status
Type # pins MSL/Lead-Free Availability
LM119H High Speed Dual ComparatorTO-100
(H10C)
10 Status Full production
LM119H/883 High Speed Dual ComparatorTO-100
(H10C)
10 Status Full production
LM361H High Speed Differential ComparatorTO-100
(H10C)
10 Status Full production
LM723CH Voltage RegulatorTO-100
(H10C)
10 Status Full production
LM723H Voltage RegulatorTO-100
(H10C)
10 Status Full production
LM723H/883 Voltage RegulatorTO-100
(H10C)
10 Status Full production
LM747H/883 Dual Operational AmplifierTO-100
(H10C)
10 Status Full production

For technical questions regarding TI and National Semiconductor products:
  • TI E2E™ Community (engineer-to-engineer online forums where you can ask questions to your fellow engineers and TI experts, as well as search for similar questions/answers)
  • TI Product Information Center (TI's email/phone support hotline for your region of the world)